Advanced Copper Lining for Accelerator Components
نویسندگان
چکیده
We have developed an electroformed copper lining having highly clean and smooth surface (i.e. little outgassing and high conductive copper) for use in accelerator components. The copper lining is produced by periodic current reversal electroforming with a low copper-content acid copper sulfate bath containing the specified amount of chloride ions (PR process). Deposit by PR process has the same value of IACS (International Annealed Copper Standard) as oxygen-free copper, and has higher breakdown field at first breakdown than the deposit by conventional types of electroformings. The cylindrical cavity with this new lining has been showed a low outgassing rate and an excellent Q value. The PR process is successfully applied to inner surface of DTL (Drift Tube Linac) and SDTL (separated DTL) cavities, surface of drift-tubes, and coils used for quadrupole magnets inside the drift-tubes.
منابع مشابه
Work supported in part by US Department of Energy contract DE-AC02-76SF00515. Dependence of Band Renormalization Effect on the Number of Copper-oxide Layers in Tl-based Copper-oxide Superconductor using Angle-resolved Photoemission Spectroscopy
W. S. Lee, K. Tanaka, I. M. Vishik, D. H. Lu, R. G. Moore, H. Eisaki, A. Iyo, T. P. Devereaux, and Z. X. Shen 4, 3 SIMES, SLAC National Accelerator Laboratory, Menlo Park, CA 94025 Advanced Light Source, Lawrence Berkeley Laboratory, Berkeley, CA Department of Applied Physics, Stanford University, Stanford, CA 94305 SSRL, SLAC National Accelerator Laboratory, Menlo Park, CA 94025 Nanoelectronic...
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